IC FPGA 500 I/O 900FCBGA XC7K325T

Basic Info.

Model NO.	XC7K325T-2FFG900I
Model	XC7K325T-2FFG900I
Batch Number	18+
Brand	XILINX
Supplier Package	BGA
Quality	Genuine New Original
Transport Package	Box
Specification	integrated circuit
Origin	China
HS Code	8542390000
Production Capacity	1000000PCS

Product Description

Description

XC7K325T-2FFG900I: IC FPGA 500 I/O 900FCBGA

Package: FPGA

Mfr. Part#: XC7K325T-2FFG900I

Mfr.: XILINX

Datasheet: (e-mail or chat us for PDF file)

ROHS Status:

Quality: 100% Original

Warranty: 180 days

Xilinx 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. Kintex-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

Key Features

• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
• High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

Part Status	Active
Number of LABs/CLBs	25475
Number of Logic Elements/Cells	326080
Total RAM Bits	16404480
Number of I/O	500
Voltage - Supply	0.97V ~ 1.03V
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 100°C (TJ)
Package / Case	900-BBGA, FCBGA
Supplier Device Package	900-FCBGA (31x31)

Company Product Line

Certificates

Why choosing us

• Located in Shenzhen, the electronic market center of China.
• 100% guarantee components quality: Genuine Original.
• Sufficient stock on your urgent demand.
• Sophisticated colleagues help you solve problems to reduce your risk with on-demand manufacturing
• Faster shipment: In stock components can ship the same day .
• 24 Hours service

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